CLOs on the Move

Aurora’s 4D heterogeneous system-in-package (4DHSiP™) technology dense packs the highest component count multichip modules into the world’s smallest footprint SiP. • 4DHSiP™ creates unmatched size, weight & power (SWaP) along with performance advantages for complex systems. • 4DHSiP™ enables leading edge upgrades to be ‘bolted on’ to existing systems and weaponry. • 4DHSiP™ offers embedded hardware security options for anti-hacking and anti-reverse engineering, i.e. physical armor for secure computing and beyond. Aurora Semiconductor is a privately held, pure play foundry in an ecosystem that includes design partner Draper Laboratory – a renown, not-for-profit applied research company; and test partner Integra Technologies – ...

Aurora’s 4D heterogeneous system-in-package (4DHSiP™) technology dense packs the highest component count multichip modules into the world’s smallest footprint SiP. • 4DHSiP™ creates unmatched size, weight & power (SWaP) along with performance advantages for complex systems. • 4DHSiP™ enables leading edge upgrades to be ‘bolted on’ to existing systems and weaponry. • 4DHSiP™ offers embedded hardware security options for anti-hacking and anti-reverse engineering, i.e. physical armor for secure computing and beyond. Aurora Semiconductor is a privately held, pure play foundry in an ecosystem that includes design partner Draper Laboratory – a renown, not-for-profit applied research company; and test partner Integra Technologies – the USA’s largest independent test house. Headquartered in St. Petersburg Florida in its DoD cleared, DMEA Trusted and ITAR registered facility, Aurora delivers wafer level packaging solutions enabled by its IP protected 4DHSiP™ MCM and Bond Coin™ chip recovery technologies.

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