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At CareFusion, we are united in our vision to improve the safety and lower the cost of healthcare for generations to come. Our 16,650 worldwide employees are passionate about healthcare and helping those that deliver it - from the hospital pharmacy to the intensive care unit, the operating theatre to the patient bedside and beyond. Our proven product families include Intermed, AVEA, VELA, SensorMedics, AirLife and respiratory products, Pyxis automated dispensing and patient identification systems, V. Mueller and Snowden-Pencer surgical instruments, Achieve Temno and Jamshidi, and the PleurX drainage system and the Alaris IV pumps (not sold in Brazil). To make global healthcare better, we partner with our customers to provide clinically differentiated respiratory solutions to help optimize patient care, improve medication management and lower the cost in procedural areas.
EUROIMMUN US is a Boonton, NJ-based company in the Healthcare, Pharmaceuticals, and Biotech sector.
Axis International is a Yardley, PA-based company in the Healthcare, Pharmaceuticals, and Biotech sector.
Medi-Nuclear Corporation is a New Hudson, MI-based company in the Healthcare, Pharmaceuticals, and Biotech sector.
Promex, located in Silicon Valley, is an ISO 13485:2003 Medical and ISO 9001:2008 certified microelectronics, semiconductor & advanced packaging and high reliability SMT/PCBA contract assembly service provider for the medical & bioscience, commercial and military markets. Core competencies allow the sequential steps of prototypes, new product introductions & beta production, followed by volume manufacturing. Complete in-house microelectronics process capabilities and process expertise uniquely integrates SMT / PCBA with microelectronics assembly. Facilities include Class 100 and Class 1000 clean rooms, RoHS optimized SMT/PCBA lines, plus development & assembly areas. ISO 13485 Medical process verification and validation using IQ, OQ, PQ and pFMEA practices and extensive use of statistical process controls. Complete Microelectronics Assembly Process Flows: • Wafer handling and sawing including 300 mm wafers • Fully automatic die attach • Wire bonding (Au ball, Al wedge, RF ribbon & wedge, Cu) • Plastic over molding (multi-chip modules, arrays, system-in-package) • Precision materials dispense • Encapsulation • Flip Chip High Reliability SMT/PCBA and Chip-on-Substrate: RoHS optimized SMT lines allow single facility process integration. Leaded solder processing also available. Chip-on-Substrate expertise. IPC-A-610 Class 3 assembly. Consigned and full turnkey SMT/PCBA and supply chain management. Quality Systems (Medical): FDA Title 21 Part 820 compliance ensures device history files, operator training records, IQ, OQ, PQ and process documentation meet all standards.