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Silicon Labs is a leading provider of silicon, software and solutions for a smarter, more connected world. Our award-winning technologies are shaping the future of the Internet of Things, Internet infrastructure, industrial automation, consumer and automotive markets. Headquartered in Austin, Silicon Labs has more than 1,400 team members in over 20 countries creating products focused on performance, energy savings, connectivity and simplicity. We`re passionate about what we do and are proud that the Global Semiconductor Alliance voted us the Most Respected Public Semiconductor company for three of the last four years.
CUI is a technology company focused on the development and distribution of electronic components. At the leading edge of power supply design, we support our customers as they strive to improve the energy efficiency and environmental credentials of their application. Our power group is complemented by a portfolio of world-class board level components, consisting of interconnect, sound, motion control and thermal products. An unwavering commitment to create collaborative partnerships with customers and a drive to see that their design project is a success has been a hallmark of our sustained growth since CUI`s founding in 1989. As a leader in the industry, we will continue to invest in the future through new technologies, talented employees, expanded manufacturing capabilities, and a growing global reach.
Health Monitoring Services is a Columbus, MS-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Micron Technology, Inc. is a global leader in advanced semiconductor memory systems. Micron`s broad portfolio of high-performance technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron`s memory solutions portfolio enables the world`s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron`s common stock is traded on the NASDAQ under the MU symbol.