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Matlin Recording Inc is a New York, NY-based company in the Computers and Electronics sector.
Sidense Corp., founded in 2004, is a leading developer of silicon-proven, embedded non-volatile memory (NVM) intellectual property (IP). Sidense`s patented 1T-Fuse™-based one-transistor one-time programmable (1T-OTP) memory enables a wide range of electronic products that are built with complex System-on-Chip (SoC) semiconductors. End-market products include home entertainment consumer products, cellular telephones and other mobile communications devices, configurable processors, RFID, medical, industrial, automotive and a host of others. Semiconductor and systems companies integrate Sidense 1T-OTP IP macros into their SoC designs, saving time and money and allowing them to focus on the core competencies that differentiate their products. Sidense provides memory IP that is difficult and uneconomical for the device makers to try to create on their own. Important requirements of Sidense customers include the need to incorporate NVM that can be manufactured on a standard-logic CMOS process with no additional masks or process steps, is field-programmable, has a very small footprint, very fast read access times, is extremely difficult to reverse engineer, and has very low operating and standby power consumption. Sidense is the only supplier of antifuse 1T-OTP IP that can meet all of these demanding requirements at the leading semiconductor foundries from 180nm to 20nm, with development underway at smaller geometries.
SiGe Semiconductor, Inc. is a leading global supplier of RF front-end solutions for next-generation wireless systems. Drawing on the unique advantages of silicon germanium technology, the company designs and delivers integrated circuits and chip-scale
i3 Electronics, Inc. (i3) is a world class supplier of electronic interconnect solutions. Effective vertical integration differentiates us from any supplier in the electronics industry. We are experts in the fabrication and assembly of ultra high-end printed circuit boards and back planes, advanced flip chip and wire bond semiconductor packaging and integration. We also provide services that complement these offerings; advanced assembly, design and layout, thermal, electrical and mechanical modeling, signal integrity, reliability and environmental testing and physical analysis. Our solutions deliver leading edge technology and best-in-class quality, performance and reliability and are available at any stage of the product life cycle. While uncommon, this offers our clients perfect and seamless extendability from prototype, pre-production and production phases without the headache of shifting facilities, processes and support personnel. i3 product lines support the needs of the defense & aerospace, industrial, telecommunications, high performance computing, semiconductor, alternative energy, and medical markets where highly reliable products built in robust manufacturing operations are critical to success.
Micronic Laser Sytems is a San Jose, CA-based company in the Computers and Electronics sector.