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Nanosys, Inc. is the leader in developing and delivering state-of-the-art Quantum Dot technology to the display industry. Nanosys proprietary QDEF® and QDOG™ technologies, key components of the Ultra High Definition (UHD) display revolution, are enabling a new generation of displays utilizing Quantum Dots to deliver vivid color, lifelike brightness and incredible power efficiency at a fraction of the cost of competing technologies. As of 2019, industry leading consumer electronics brands have shipped more than 10 million devices from tablets to monitors and TVs based on Nanosys` proprietary Quantum Dot technology. Founded in 2001, the company is headquartered in Silicon Valley, California where it operates the world`s largest Quantum Dot nanomaterials fab. Nanosys currently owns or has exclusive license rights to more than 350 issued and pending patents worldwide.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Avex Aerospace Corporation is a Torrance, CA-based company in the Computers & Electronics sector.
Grandis is a Milpitas, CA-based company in the Computers and Electronics sector.
Trek is a Medina, NY-based company in the Computers and Electronics sector.